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DDR5 ecosystem growing with memory interface components


The DDR5 chipset solutions call for memory interface solutions that can effectively handle signal integrity and thermal management for data center servers, desktops, and laptops. Rambus claims to have answered the call by expanding its DDR5 memory interface chip portfolio with series presence detect (SPD) hub and temperature sensor devices.

That complements the company’s registering clock driver (RCD) technology and is expected to improve DDR5 dual inline memory module (DIMM) system management and thermal control, thus ensuring higher performance within the desired power envelope. The SPD hub and temperature sensor on a memory module sense and report important data for system configuration and thermal management.

The SPD hub is used in both server and client modules, including registered DIMMs (RDIMMs), unbuffered (UDIMMs) and small-outline DIMMs (SODIMMs). On the other hand, the temperature sensor is designed for server RDIMMs.

Source: Rambus

The big data applications are placing tremendous pressure on data center memory systems for increased performance and capacity. That, in turn, is transforming server memory architecture supporting memory-intensive cloud deployments and artificial intelligence (AI) applications. Here, DDR5 achieves greater memory bandwidth and capacity by employing a new module architecture with an expanded chipset.

However, DDR5 memory modules require new components for client and server systems. That includes memory interface devices such as RCD, SPD hub, and temperature sensor. These interface devices are crucial in the DDR5 chipset’s ability to enable breakthrough bandwidth and capacity for advanced computing systems.

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