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5G SoC offers mmWave connectivity

MediaTek debuted its first 5G mmWave chip, the Dimensity 1050, boasting seamless connectivity, fast displays, gaming, and power efficiency. Through dual connectivity, the device provides long-range sub-6 GHz (FR1) and super-fast mmWave (FR2) connections, even in densely populated areas.

By performing 3CC carrier aggregation on sub-6 GHz spectrum and 4CC carrier aggregation on mmWave spectrum, the Dimensity 1050 achieves up to 53% faster speeds and greater reach than LTE + mmWave aggregation alone. In addition, the part includes built-in Wi-Fi 6E and Bluetooth 5.2 capabilities.

Manufactured on a 6-nm process, the Dimensity 1050 employs an octa-core CPU comprising two 2.5-GHz Arm Cortex-A78 cores and six 2.0-GHz Arm Cortex-A55 cores. It also packs an Arm Mali-G610 graphics engine. MediaTek’s HyperEngine 5.0 gaming technology improves power efficiency and ensures lower-latency connections to extend game time and performance. Other chip features include support for 144-Hz full HD displays with intense, vibrant colors and dual high dynamic range (HDR) video capture.

Smartphones powered by the Dimensity 1050 are expected to be on the market in 3Q 2022.

Dimensity 1050 product page


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